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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 16 Jul 1999 13:00:08 -0600 |
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IPC-R-700 C procedure 5.2.2 allowed use of surface jumper wire attached to
component leads to repair a missing/severed trace.
IPC-7721 does not include this procedure. The closest in technique is
procedure number 4.2.4, however the jumper is soldered to residual circuit
traces.
I recognize the inherent problem of IPC-R-700 procedure 5.2.2, that it
interferes with component replacement.
The dilemma I face is that a board has been repaired using IPC-R-700 C
procedure 5.2.2, but the customer does not recognize IPC-R-700C.
Has IPC-R-700 C been totally discarded and replaced by IPC-7721?
Are the techniques of IPC-R-700 C still acceptable?
Thanks for your assistance.
Dennis Guy-Sell
Quality Engineer
EDO Electro-Ceramic Products
2645 South 300 West
Salt Lake City, Utah 84115
801-486-7481 ext. 219
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