TECHNET Archives

July 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Date:
Thu, 8 Jul 1999 15:01:24 -0700
Reply-To:
[log in to unmask]
Subject:
PCB fab process
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset=us-ascii
Organization:
RadioConnect Corp.
From:
Donna Perry <[log in to unmask]>
Parts/Attachments:
text/plain (13 lines) 
Question 1:
What website gives a good outline with some
explanation of the PCB fabrication process for
multilayer boards?  I would like to be less
presumptive with our RF board fabrication drawing
notes, but need more input.

Question 2:
Is IPC-D-275 an active document, or has it been
superceded by another?

Thanks, D.Perry

ATOM RSS1 RSS2