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July 1999

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TechNet <[log in to unmask]>
X-To:
Francis Lai <[log in to unmask]>
Date:
Wed, 7 Jul 1999 13:52:12 -0600
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Timothy A. Estes" <[log in to unmask]>
Subject:
Cu thickness varies from panel to panel
From:
"Timothy A. Estes" <[log in to unmask]>
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Hi Francis,

To characterize and improve your plating uniformity you must be able to
measure the copper thickness over the surface of each panel from each rack
position.  A large task!   We have a unique method which uses specialized
test patterns to obtain copper thickness from one-inch-square modules
covering the entire panel surface.  You may contact me off line for more
information.

Best regards,

Tim Estes
Conductor Analysis Technologies Inc.
Phone: 505-797-0100
Fax: 505-797-1605
Email: [log in to unmask]
Web: http://biz.swcp.com/cat


-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Francis Lai
Sent:   Sunday, July 04, 1999 12:25 PM
To:     [log in to unmask]
Subject:        [TN] Cu thickness varies from panel to panel

Recently, I have found that Cu thickness plated onto panels may vary uo
to 150 u inches from one panel to another under the same conditions and
current and in the same bath.
Did I do anything wrong? I am using a Macdermid acid plating bath 9241.

My e-mail : [log in to unmask]

THANKS!!!!!!!!

Francis

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