Earl,

Thanks for the feedback.  We have actually been shimming the parts using
kapton dots to make columns.  Dispensing epoxy to support them may be more
consistent and is something I'll look into.

Regards,


Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Earl Moon
Sent: Wednesday, July 28, 1999 1:17 PM
To: [log in to unmask]
Subject: [TN] Texas Instruments 6701 BGA Package


I've never dealt with the device type. However, If you want the reliability
of a column type BGA solder joint, use glue to attach the device curing it
not allowing significant collapse. Now you support the weight and get the
compliance afforded CCBGA solder joints.

Earl Moon

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