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July 1999

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From:
Earl Moon <[log in to unmask]>
Date:
Wed, 28 Jul 1999 15:17:21 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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I've never dealt with the device type. However, If you want the reliability
of a column type BGA solder joint, use glue to attach the device curing it
not allowing significant collapse. Now you support the weight and get the
compliance afforded CCBGA solder joints.

Earl Moon

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