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July 1999

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Sender:
TechNet <[log in to unmask]>
X-To:
Mike Bailey <[log in to unmask]>
Date:
Fri, 2 Jul 1999 06:46:54 -0700
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
Re: Blind Via Construction
From:
"Alan B. Cochrane" <[log in to unmask]>
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Mike,
2 ply's of 106 will be much better.  The glass content is less and wil
require much less time to drill as well the hole quality will be much
smoother.

Regards,

Alan B. Cochrane
CTO
PCWorld


Mike Bailey wrote:
>
> I have a product that requires a .006 dia. laser ablated via from lyr 1 to
> 2.  I'm required to use glass re-inforced FR-4 as a dielectric.  The
> dielectric is approx .0035. I can either use a single ply of 2313 or 2 plies
> of 106 prepreg.  Which would be the most favorable construction in terms of
> laser hole quality and subsequent processing?

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