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July 1999

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From:
Brett Goldstein <[log in to unmask]>
Date:
Tue, 13 Jul 1999 09:05:45 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, Brett Goldstein <[log in to unmask]>
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I was actually just researching this (electroless Ni-Au plating of
wafers) last week.  One source that I found is Enthone OMI,
www.enthone-omi.com, which makes a product under the name
Microfab EN 100 (for electroless Nickel plating of wafers) and
Microfab IG 100 (for immersion gold plating).

While we're on the subject, does anybody have any experiences
they'd like to share using these chemistries, especially on
singulated die?

Brett Goldstein
EVI, Inc.

Date sent:              Mon, 13 Jul 1998 09:41:13 +0800
From:                   jonat <[log in to unmask]>
Subject:                Electroless Ni-AU for Si/Al Wafers

> Has any one knows chemistry for Al/Si wafer plating by Electroless Ni-AU?
>
> Jonathan
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