DESIGNERCOUNCIL Archives

July 1999

DesignerCouncil@IPC.ORG

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DesignerCouncil <[log in to unmask]>
Subject:
From:
Jack Olson <[log in to unmask]>
Date:
Thu, 22 Jul 1999 18:24:30 -0700
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1.0
X-To:
Bob Landman <[log in to unmask]>
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"DesignerCouncil E-Mail Forum." <[log in to unmask]>, Jack Olson <[log in to unmask]>
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Thank you for taking the time to respond.
Boy, it sure is difficult to keep up these days,
one guy says one thing, another says the opposite.
So, is there NO advantage to reducing the material between planes?

onward thru the fog,
Jack

                -----Original Message-----
                From:   Bob Landman [mailto:[log in to unmask]]
                Subject:        Re:      Re: [DC] Stackup assignment for pcb
boards.

                Jack,

                Brooks wrote recently about planes acting as caps - they do
not

                Much as we don't like them, every single power pin MUST be
bypassed by 0.1uF
                caps - if a large chip like a BGA or PLCC has say 4 power
pins - bypass them ALL
                or pay the piper.

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