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June 1999

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TechNet E-Mail Forum.
Date:
Wed, 30 Jun 1999 06:12:29 -0400
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improper setting of the wire bonding parameters will lead to crack the die
or damage the underlining metallization.  ESD is less likely cause (I
haven't seen ESD damage due to wire bonding mechine.  Operator handling is a
different story---Don't tell me you hand pick the die!).
                                    jk
At 08:21 AM 6/30/99 +0100, you wrote:
>     Kiet,
>
>        I dont know the device in question, but when the EFO does its
>     thing, it should be a good way off the die, so any chance of a direct
>     arc is minimal, and you should be able to see it.  I dont know if the
>     spark would damage the die through static, EMC etc as thats not my
>     field.
>
>        Also, dont just consider the obvious, are the die good when you get
>     them? and immediatly before you try and bond them? Ive seen this
>     before where there were "known questionable die" and the bonding was
>     being blamed.  It could be worth cheking the mechanical quality of the
>     bond, are you getting cratering to any degree, or damage to the
>     metallisation from vibration etc, if so review the bond parameters.
>
>                Good luck,
>                     Roger
>
>
>
>______________________________ Reply Separator
_________________________________
>Subject: [TN] Ball Bonding
>Author:  "TechNet E-Mail Forum." <[log in to unmask]> at #email
>Date:    29/06/99 13:52
>
>
>     Hello All,
>     I'm trying to find the cause for blowing GaAS Ka-Band MMIC power
>amplifier
>     in our hybrid assembly process. One of the most suspicious process is
>auto
>     ball bonding, Hughes model 2460-IV. My question is What is the
>possibility
>     of the EFO from the ball bonder can zap the MMIC?
>
>     Thanks in advance,
>     Kiet Dang
>     Stellex Microwave System
>     [log in to unmask]
>

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