Hello All,
I'm trying to find the cause for blowing GaAS Ka-Band MMIC power
amplifier
in our hybrid assembly process. One of the most suspicious process is
auto
ball bonding, Hughes model 2460-IV. My question is What is the
possibility
of the EFO from the ball bonder can zap the MMIC?
Thanks in advance,
Kiet Dang
Stellex Microwave System
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