IPC-VT-MHD
Microvias and High Density Interconnects

To maximize the benefit of miniature IC packaging, the user must consider
efficient
and cost effective use of the circuit board fabrication technology available
today,
as well as looking ahead to emerging technologies.  Multilayer circuits using
via-in-land or "microvia" methodology provide the designer direct access to
higher
circuit density on the subsurface layers of the circuit structure.  Three
alternative
microvia interconnect methods are currently in use: laser, photo-defined and
plasma-displacement.  Detailed information and design guidelines that are
specific to each of the microvia technologies noted above are discussed.  In
addition, examples of fine-pitch QFP, BGA, and CSP products are examined,
circuit routing criteria defined and other issues related to adapting
miniature IC device packaging and high density circuits are reviewed.  Also
covers drivers for product miniaturization, base material selection for HDI,
IC component packaging, planning for high density
circuits, panelization for assembly efficiency, and sources for HDI and cost
considerations.

Presented by Vern Solberg or Tessera Inc. at IPC Assembly Expo, October 1998.
 Includes Workshop Handbook containing 118 images presented during the
workshop.  Edited to two videotapes.
Time: 1 hour 37 minutes.

IPC Members: $350           Nonmembers: $500


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