Hello Technetters,

I am encountering several problems with a  heat sink assembly process.
Currently, our heat sinks are hand placed onto cpus and other components
using an epoxy dispenser ( automatic ) and a steady hand.

The Problem:  The heat sinks are not seating properly, misaligned and
uneven due to operator error.  Some of our products use clips and pins
for heat sink placement, but several do not.  I know that this is an
issue of board real estate that needs to be resolved between
manufacturing and engineering, but until then I am looking for a
solution.

I want to take the human factor out of this heat sink placement so I can
achieve the proper alignment and force to attach heat sinks to
components.  They are to large and cumbersome for any high speed
placement machine.


If anyone has experienced this problem and has any suggestions, your
response would be much appreciated.