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June 1999

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Subject:
From:
Sunil Gupta <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 16 Jun 1999 13:57:00 +0530
Content-Type:
text/plain
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text/plain (19 lines)
We were using such glue initially but had to heat the glue after UV. Hence
we switched over to Heating type only. The other problem faced was that the
glue if it was completely under the component than it did not get curred.

regards
Sunil Gupta

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