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June 1999

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Tue, 15 Jun 1999 22:26:25 -0500
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All,
I'm looking for the IPC resistive spec. for the flux left behind after the
wave solder/ IR process on the finished assembly board.

I've a couples of questions for anyone to address:
1.      How to measure the resistive flux residue on the finished assembly
board level?
        ( is it a common in the industry that requesting Sub-con house to
measure and control them)?
2.      What is the IPC  recommended resistive spec. for the flux residue
that left behind( referring to Non-clean process)

Thanks,
Desmond Leu

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