Absolutely correct. [log in to unmask] Sorry I left off that little tidbit of
address. Jack
>>> "Anderson, Greg (IndSys, GEFanuc, NA)" <[log in to unmask]> 06/14/99
10:08AM >>>
Jack,
Regarding your posting, should that be [log in to unmask] ?
Thanks,
Greg Anderson
Advanced Manufacturing Engineer
GE Fanuc Automation, N.A.
Charlottesville, VA
phone: (804)-978-5181
e-mail: [log in to unmask]
-----Original Message-----
From: Jack Crawford [SMTP:[log in to unmask]]
Sent: Monday, June 14, 1999 11:01 AM
To: [log in to unmask]
Subject: Re: [TN] BGA reliability testing
IPC-7095 is at the PROPOSAL stage and can be received by anyone who
can receive
e-mail message attachments.
Just send an e-mail message to: techdoc
And the SUBJECT line must be exactly these characters/spacing:
request IPC-7095
The body should have just your name, company and contact phone
number in case there
is a problem with the e-mail and we need to contact you.
jack
==========================================
APEX - the industry's premier trade show in Electronics
Manufacturing, March 12-16, 2000, Long Beach, California.
More information on website www.ipc.org/html/apex.htm
-----------
Jack Crawford, IPC Director of Assembly Standards and Technology
2215 Sanders Road, Northbrook IL 60062-6135
[log in to unmask]
847-790-5393
fax 847-509-9798
>>> "McMonagle, Michael R." <[log in to unmask]> 06/12/99 07:44AM
>>>
Jason,
The current working draft of IPC-7095, Design and Assembly
Process Implementation for BGAs, speaks to this issue in Section 6.4
(Impact of Wave Solder on Top Side BGAs) along with ways to validate
and
correct if required. This is an extremely solid reference on BGAs,
its
ultimate release will be of great help to those just beginning to
venture into BGAs. As the file is a little big for TechNet (don't
want
to tick off Hugo, hehehe), I'll send it to you direct under separate
EMail. Remember that draft standards are usually available from IPC
for
review and comment on a variety of topics, but any pass/fail
criteria
should not be used as an absolute based on a draft revision.
Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX 77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]
> -----Original Message-----
> From: Jason Smith [SMTP:[log in to unmask]]
> Sent: Friday, June 11, 1999 2:45 PM
> To: [log in to unmask]
> Subject: Re: [TN] BGA reliability testing
>
> What does the industy do for qualifications and reliability for
BGAs?
> What
> testing is generally done. I'm trying to see if a BGA connection
is
> affected in
> any way by going through the wave solder for qualifying that in
our
> process.
> Any insight would be helpful.
>
> Jason
>
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