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June 1999

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Subject:
From:
Kenneth Kirby <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Kenneth Kirby" <[log in to unmask]>
Date:
Mon, 14 Jun 1999 10:16:37 -0500
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (2103 bytes) , pic16399.pcx (2490 bytes)



They could have used a selective soldering for the through hole but this is
a rather slow process if this is a high production board.  Most likely they
used a pallet that masked the QFP's from the solder waves but left open the
areas where the through hole components are.  This is getting to be very
common and works well if the pallet design is done correctly.

Ken Kirby
Wavesolder
Product Specialist
Speedline





 (Embedded
 image moved   Jorge Engenharia <[log in to unmask]>
 to file:      06/14/99 08:28 AM
 pic16399.pcx)




To:   [log in to unmask]
cc:    (bcc: Kenneth Kirby/ElectrovertUS/Cookson)
Subject:  [TN] Manufacturing process




 Hi techies,

  I received a board sample that probably we could assembly here, but I had
one doubt about the manufacturing process.
  The board is a VGA card and has trough hole and SMD components at top
side
and 2 QFP 100 at bottom side. The 2 QFP had no glue attaching the
components
and were not soldered by solder wave machine, but all trough hole
components
were soldered.
  The question is :
  The 2 QFP were covered with solder mask and passed to the solder wave
machine ? Or they used selective solder to avoid contact with the 2 QFP ?
Or
there are other ways to assembly this kind of board ?
   I am trying to figure out how they assembly this board, I am not
familiar
with this kind of assembly.
   Any input will be apreciated.

Thanks

Jorge Dourado de Santana
Maintenance / Process Engr
Microtec - Brazil

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