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June 1999

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Subject:
From:
Jorge Engenharia <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Jorge Engenharia" <[log in to unmask]>
Date:
Mon, 14 Jun 1999 09:28:46 -0400
Content-Type:
text/plain
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text/plain (45 lines)
 Hi techies,

  I received a board sample that probably we could assembly here, but I had
one doubt about the manufacturing process.
  The board is a VGA card and has trough hole and SMD components at top side
and 2 QFP 100 at bottom side. The 2 QFP had no glue attaching the components
and were not soldered by solder wave machine, but all trough hole components
were soldered.
  The question is :
  The 2 QFP were covered with solder mask and passed to the solder wave
machine ? Or they used selective solder to avoid contact with the 2 QFP ? Or
there are other ways to assembly this kind of board ?
   I am trying to figure out how they assembly this board, I am not familiar
with this kind of assembly.
   Any input will be apreciated.

Thanks

Jorge Dourado de Santana
Maintenance / Process Engr
Microtec - Brazil

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