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June 1999

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Subject:
From:
Jon Moore <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 12 Jun 1999 19:39:41 EDT
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In a message dated 5/24/99 11:12:24 AM US Eastern Standard Time,
[log in to unmask] writes:

<< Hi  everyone,                                                     I am
 interested in getting information on wave solder no clean flux evaluation
 techniques.    What tests are people using to determine the best no clean
flux
 for spray and foam fluxers. >>

I have used tests that push the upper and lower limits of the process window.
 Preheat schedules that are too hot and tool cool per my "normal" process
would give me an idea of the robustness of a flux.  Artificial aging of
boards with a humidity chamber prior to wave soldering tests the activity
level and aggressiveness.  Of course, post process testing, such as SIR, ion
chromatography, and other forms of contamination measurement are important in
understanding the effects of a given process chemistry on field performance.
If the product includes conformal coating, don't forget to test compatibility
of the residues with the coating.

Jon Moore
Z-Tech Services

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