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June 1999

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Subject:
From:
Jason Smith <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Jun 1999 17:23:22 -0400
Content-Type:
text/plain
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text/plain (68 lines)
We currently run BGAs through a single sided process.  We do mixed technology
but handle the pinthrough via paste-in-hole.  The question was posed to me
whether subsequently running the boards across the solder wave hurt the joint
any.  I'm looking at what does the industry to do qualify so I can do a "heads
up" comparison between ones that have gone over the wave against one that
doesn't.  I'm looking for some direction.



[log in to unmask] on 06/11/99 05:02:57 PM

Please respond to [log in to unmask]; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Jason Smith/Lex/Lexmark)
Subject:  Re: [TN] BGA reliability testing




In a message dated 06/11/1999 2:48:37 PM US Eastern Standard Time,
[log in to unmask] writes:

> What does the industy do for qualifications and reliability for BGAs?  What
>  testing is generally done.  I'm trying to see if a BGA connection is
> affected in any way by going through the wave solder for qualifying that in
our process.
>  Any insight would be helpful.

Whenever the word "qualification" is used, it begs the question
"Qualification to what standard"?  To my knowledge, there is no IPC (or other
organization) that specifically covers qualification of a BGA attach process.
 J-STD-001, revision B, when modified with a little engineering insight and
use of a suitable test vehicle, could be used.  Do you have internal
workmanship standards or quality control provisions that your are trying to
meet?

Doug Pauls
Technical Director
CSL

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