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June 1999

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Subject:
From:
Doug Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Jun 1999 17:02:57 EDT
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In a message dated 06/11/1999 2:48:37 PM US Eastern Standard Time,
[log in to unmask] writes:

> What does the industy do for qualifications and reliability for BGAs?  What
>  testing is generally done.  I'm trying to see if a BGA connection is
> affected in any way by going through the wave solder for qualifying that in
our process.
>  Any insight would be helpful.

Whenever the word "qualification" is used, it begs the question
"Qualification to what standard"?  To my knowledge, there is no IPC (or other
organization) that specifically covers qualification of a BGA attach process.
 J-STD-001, revision B, when modified with a little engineering insight and
use of a suitable test vehicle, could be used.  Do you have internal
workmanship standards or quality control provisions that your are trying to
meet?

Doug Pauls
Technical Director
CSL

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