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June 1999

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Subject:
Re: Ni. Plating
From:
Richard Haynes <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Richard Haynes" <[log in to unmask]>
Date:
Fri, 11 Jun 1999 16:47:19 -0400
Content-Type:
text/plain
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text/plain (61 lines) 
Hi,
Typical 100-200 uin depending on the surface roughness of CuBe. The smoother
the low the Ni. Au should be porious in not the Ni must be smooth.
Richard Haynes
609-497-4584



-----Original Message-----
From: Henry Kruckeberg <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, June 10, 1999 12:42 PM
Subject: [TN] Ni. Plating


>Does anyone have any info on the optimum Ni. thickness to prevent base
metal
>migration in a electro deposited AU. over Ni.  on beryllium copper
application.
>
>Any input appreciated
>
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