John,

  I dont believe you are going to achieve this with stencil printer method.
Probably you have to mix with sirynge dispense to get the glue dot heigh
that you need, if you don't has automatic glue dispenser you can try manual
dispenser that has ability for different nozzle, presure and time adjustment
( Loctite has one model ). Beware with the glue dot amount because if you
need do rework ...

Thanks

Jorge Dourado de Santana
Maintenance / Process Engr
Microtec - Brazil



> -----Original Message-----
> From: John Chandler [SMTP:[log in to unmask]]
> Sent: 9 de Junho de 1999 10:55
> To:   [log in to unmask]
> Subject:      [TN] Gluing components
>
> We have a simple board in which we are using our screen printer to apply
> reflow curing glue, in between the pads, etc.
>
> The chipshooter components 0603, sots, etc do perfectly.
>
> The IC's and any other part with a gull wing, J wing type do not have
> enough glue to even touch the bottom of the parts. Because as you know,
> the
> body sits off the board
>
> Step stencil comes to mind but never done that YET. Using rubber squeegees
> on printer. Tried putting in a big snapoff where it would leave a space
> between the pcb and stencil but this helps but not a cure. Any
> suggestions.
>
> Step stencil, stencil thickness. Did not put what thickness of what
> stencil
> we use to see what you all have to say.
>
> Thanks in advance.
>
> John
>
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