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June 1999

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Subject:
From:
Ian Squires <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Jun 1999 09:09:02 +0000
Content-Type:
text/plain
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text/plain (105 lines)
Considering that you are using 0603's I would be wary of increasing the   
size of the screen all over. Most practical method is to dispense double   
dot (or more) or increase dispense time for components that need more   
adhesive.



Ian Squires

Production Engineering Manager
Redifon MEL, Crawley, UK
Tel: 44 (0) 1293 466300  xT 2425

 ----------
From:  [log in to unmask]
Sent:  10 June 1999 01:51
To:  [log in to unmask]
Subject:  [TN] Gluing components

 --------------------------------------------------------------------------  
 --
We have a simple board in which we are using our screen printer to apply
reflow curing glue, in between the pads, etc.


The chipshooter components 0603, sots, etc do perfectly.


The IC's and any other part with a gull wing, J wing type do not have
enough glue to even touch the bottom of the parts. Because as you know,   
the
body sits off the board


Step stencil comes to mind but never done that YET. Using rubber   
squeegees
on printer. Tried putting in a big snapoff where it would leave a space
between the pcb and stencil but this helps but not a cure. Any   
suggestions.


Step stencil, stencil thickness. Did not put what thickness of what   
stencil
we use to see what you all have to say.


Thanks in advance.


John


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-- 

Ian Squires  [log in to unmask]
http://www.rmel.com   Tel: +44 (0)1293 446300

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