John.

Why are you trying to glue J leaded components. I trust you are not going to
wave solder them. The high profile of the parts makes them almost impossible
(I have never even attempted) to wave solder them.

But maybe someone in Technet land Has!!


===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
9/06/99 14:54
>We have a simple board in which we are using our screen printer to apply
>reflow curing glue, in between the pads, etc.
>
>The chipshooter components 0603, sots, etc do perfectly.
>
>The IC's and any other part with a gull wing, J wing type do not have
>enough glue to even touch the bottom of the parts. Because as you know, the
>body sits off the board
>
>Step stencil comes to mind but never done that YET. Using rubber squeegees
>on printer. Tried putting in a big snapoff where it would leave a space
>between the pcb and stencil but this helps but not a cure. Any suggestions.
>
>Step stencil, stencil thickness. Did not put what thickness of what stencil
>we use to see what you all have to say.
>
>Thanks in advance.
>
>John
>
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Mark Austin (Process Engineer)
ACW Technology Limited
Hylton Road
Petersfield
GU32 3XX
ENGLAND

TEL - +44 (0) 1730 300000
FAX - +44 (0) 1730 266045

Email - [log in to unmask]

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