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June 1999

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Subject:
Re: Gluing components
From:
ed hale <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Jun 1999 17:03:38 +1000
Content-Type:
text/plain
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John,
        Try 7 mil polyimide stencils. They seem to work well from
what I hear . Talk to Hugh at KJ Marketing .
Regards
Ed Hale

>We have a simple board in which we are using our screen printer to apply
>reflow curing glue, in between the pads, etc.
>
>The chipshooter components 0603, sots, etc do perfectly.
>
>The IC's and any other part with a gull wing, J wing type do not have
>enough glue to even touch the bottom of the parts. Because as you know, the
>body sits off the board
>
>Step stencil comes to mind but never done that YET. Using rubber squeegees
>on printer. Tried putting in a big snapoff where it would leave a space
>between the pcb and stencil but this helps but not a cure. Any suggestions.
>
>Step stencil, stencil thickness. Did not put what thickness of what stencil
>we use to see what you all have to say.
>
>Thanks in advance.
>
>John
>
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