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June 1999

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Subject:
From:
Joe Wackerman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 Jun 1999 16:57:39 -0700
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text/plain (61 lines)
I use a glue dispensor, double up on the dots. Joe

At 03:54 PM 6/9/99 +0200, you wrote:
>We have a simple board in which we are using our screen printer to apply
>reflow curing glue, in between the pads, etc.
>
>The chipshooter components 0603, sots, etc do perfectly.
>
>The IC's and any other part with a gull wing, J wing type do not have
>enough glue to even touch the bottom of the parts. Because as you know, the
>body sits off the board
>
>Step stencil comes to mind but never done that YET. Using rubber squeegees
>on printer. Tried putting in a big snapoff where it would leave a space
>between the pcb and stencil but this helps but not a cure. Any suggestions.
>
>Step stencil, stencil thickness. Did not put what thickness of what stencil
>we use to see what you all have to say.
>
>Thanks in advance.
>
>John
>
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Joe Wackerman
Sr. Mechanical Engineer
Parker Hannifin
Compumotor Division
5500 Business Park Drive
Rohnert Park, CA 94928
http://www.compumotor.com
voice 707-584-2522
FAX 707-584-8015
e-mail [log in to unmask]

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