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June 1999

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Subject:
From:
John Chandler <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, John Chandler" <[log in to unmask]>
Date:
Wed, 9 Jun 1999 15:54:59 +0200
Content-Type:
text/plain
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text/plain (43 lines)
We have a simple board in which we are using our screen printer to apply
reflow curing glue, in between the pads, etc.

The chipshooter components 0603, sots, etc do perfectly.

The IC's and any other part with a gull wing, J wing type do not have
enough glue to even touch the bottom of the parts. Because as you know, the
body sits off the board

Step stencil comes to mind but never done that YET. Using rubber squeegees
on printer. Tried putting in a big snapoff where it would leave a space
between the pcb and stencil but this helps but not a cure. Any suggestions.

Step stencil, stencil thickness. Did not put what thickness of what stencil
we use to see what you all have to say.

Thanks in advance.

John

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