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Date: | Wed, 9 Jun 1999 11:29:46 -0500 |
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Hi TechNet! I have a question involving the IPC-SM-785 failure definition.
In paragraph 4.3.1 the definition of solder joint failure is stated as a
short duration, high resistance spike (time = approximately 1usec and a
resistance window of 300 ohms). However, in paragraph 7.8 failure criteria
for solder joint fatigue tests, the failure detection limits are a polling
time of 2 seconds or less, with a resistance window of 1000 ohms. This
appears to be a contradiction within the guidelines. I understand that the
use of a resistance window of 300 ohms will subject the test to a greater
amount of noise and potential false negative responses but it has been my
experience that these noise/false negative incidents can be handled with
proper trouble shooting and test monitoring. I am looking for viewpoints -
does a contradiction exist or is it an issue of tester confidence?
Dave Hillman
Rockwell Collins
[log in to unmask]
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