Hi TechNet! I have a question involving the IPC-SM-785 failure definition.
In paragraph 4.3.1 the definition of solder joint failure is stated as a
short duration, high resistance spike (time = approximately 1usec and a
resistance window of 300 ohms). However, in paragraph 7.8 failure criteria
for solder joint fatigue tests, the failure detection limits are a polling
time of 2 seconds or less, with a resistance window of 1000 ohms. This
appears to be a contradiction within the guidelines. I understand that the
use of a resistance window of 300 ohms will subject the test to a greater
amount of noise and potential false negative responses but it has been my
experience that these noise/false negative incidents can be handled with
proper trouble shooting and test monitoring. I am looking for viewpoints -
does a contradiction exist or is it an issue of tester confidence?

Dave Hillman
Rockwell Collins
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################