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June 1999

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Subject:
From:
Paul Brown <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Paul Brown" <[log in to unmask]>
Date:
Sat, 5 Jun 1999 06:47:31 +0100
Content-Type:
text/plain
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text/plain (61 lines)
Have you checked the plating rate , it sounds as if the electroless copper
bath is over active causing nodular copper growth
I am assuming you are using high build, which Macdermid electroless is it ?
(I am ex Macdermid Technical Sales in UK)

----- Original Message -----
From: Francis Lai <[log in to unmask]>
To: <[log in to unmask]>
Sent: 05 June 1999 01:56
Subject: [TN] PTH Problem


> We use the Macdermid PTH line. Recently, after PTH there are fluffy,
> small minute copper deposits around the drilled holes besides the
> electroless copper on the PTH walls. The copper surface of the panel
> looked porous. After copper plating, they became pits on the surface of
> the panel and nodules on the PTH walls.
> Can any one help?
> My e-mail : [log in to unmask]
> THANKS!!!!!!!
>
> Francis
>
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