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June 1999

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Subject:
From:
KELLY M SCHRIVER <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, KELLY M SCHRIVER" <[log in to unmask]>
Date:
Fri, 4 Jun 1999 10:32:00 -0400
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Hi Bob -

We've had fairly good success with the tape type heat transfer materials in
applications where we're dealing with two flat surfaces, such as between a DIP
body and a thermal frame.  The tape type materials can be laid down in long
strips which extend under numerous parts.

You'll need to be sure that the tape adhesives don't present a problem with
compatibility when it comes to fluxes, cleaners and conformal coatings.  If
the adhesives start to wash out in a cleaning cycle, you can end up with a
process residue trap under the tape, or an adhesive ooze on the board that
behaves like a contaminant.

The tapes haven't the capability to fill gaps and variations, such as are
encountered under part bodies which are positioned over insulated vias and
similar items.  The tapes also don't accomodate the height variations which
occur with surface mount components.

Regards - Kelly

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