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June 1999

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Subject:
From:
"Meigs, Jonathan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Meigs, Jonathan" <[log in to unmask]>
Date:
Fri, 4 Jun 1999 05:20:16 -0700
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text/plain (83 lines)
Vishy,

I'm not a flex guru, but I would suggest Enthone-OMI might be a good source
of information regarding LPISM. My literature suggests to contact David
Stone at (203)932-8631, or Roger Landolt at (203) 932-8668.

Best of luck,
Jonathan Meigs
Product Development Engineer


-----Original Message-----
From: Narayana Vishy-CVN002 [mailto:[log in to unmask]]
Sent: Friday, June 04, 1999 12:02 AM
To: [log in to unmask]
Subject: [TN] LPISM


Hi techies :

Any flex gurus out there know about LIQUID PHOTOIMAGEABLE SOLDERMASK
(LPISM)...Where can I find info about this ? And how good is this in
eliminating typical dimensional inconsistencies on flex ciruits such as

*       Shrinkage during lamination
*       Adhesive squeeze out
*       Coverlay registration

Regards ,
vIshY

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