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June 1999

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Subject:
LPISM
From:
Narayana Vishy-CVN002 <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Narayana Vishy-CVN002" <[log in to unmask]>
Date:
Fri, 4 Jun 1999 11:58:36 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (35 lines) 
> Hi techies :
>
> Any flex gurus out there know about LIQUID PHOTOIMAGEABLE SOLDERMASK
> (LPISM)...Where can I find info about this ? And how good is this in
> eliminating typical dimensional inconsistencies on flex ciruits such as
>
> *     Shrinkage during lamination
> *     Adhesive squeeze out
> *     Coverlay registration
>
> vIshY

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