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June 1999

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Subject:
From:
Bob Vanech <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 Jun 1999 14:33:41 +0000
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  To all..
           I attempted to send this message out on Wed.,
but I think my fat fingers must have hit the wrong key..
Oh well, I'll try again..... First, HAPPY THUR....
Second, we are going to be using a thermally conductive
electrically insulating adhesive tape and pre-cut forms
to conduct the heat from the components, through the pwb
(10-12 layers) to the backplate (heatsink). Does anyone
have any hands-on experience with this product,
especially from the manuf. side, and would like to share
their war stories???? Thanks in advance and have a great
day...

  Regards,
  Bob Vanech
  Mango Computers

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