Morning Mike,
about your material: something for RF applications up to 30 GHz? We
build T/R-modules in LTCC today. Somewhat expensive. How many layers are
practical with your material? Can built-in RF-lines be applied? And
grids? And what about FlipChip applications?
                                    See you/ Ingemar Hernefjord
                                    Ericsson Microwave Systems


----------------------------- old ref --------------------------------
> Miguel,
>
> our standard 4-layers DYCOstrate microvia substrates are about 0.2mm
> thick (polyimide material). Each layer pair is about 50 microns thick.
> For a 8-layer microvia build-up we get about 0.5mm.
>
> In the DYCOstrate foil approach through-vias connect the central two
> layers while staggered blind-vias connect the outer layers to the
> central ones.
> The microvias diameter can be down to 50 microns and pads down to 150
> microns. Lines/spaces can be down to 50/50 microns.
>
> Please contact me off-line for more info or have a look at our web
site
> for build-up description and applications examples.
>
> Best regards,
> Mike
>
> > Hello All,
> >         I am writing to ask if anyone has information on "ultra"
thin PC
> > boards.  For example, a four layer board with a thickness of about
0.5mm.
> > We are currently looking for thinner board technologies, and are
> > investigating several possibilities.  Any help is greatly
appreciated.
> > Thank you in advance.
> >
> > Regards,
> >
> > Miguel B. Galvez
> > Engineering Technologist
> > Hewlett Packard - Portable Capture and Communication
>
> _____________________________________________________________________
> Dr. Michele B. Stampanoni (Mike)      Phone:        +41  1 306 20 30
> Manager Marketing & Sales             Fax:          +41  1 306 36 40
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>
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