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Date: | Thu, 3 Jun 1999 12:11:56 -0700 |
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If reference to Mr. Mike Gish's post. This article also references:
"Thomson uses a very sophisticated software package that's both
Interactive and dynamic, which allows the PCB designer to place
insertable components correctly the first time, without wasting time on
Checking all the parameters that govern autoplacement of components."
Does anyone know of this software (company, cost, exact features)?
Or is this software unique to Thomson Electronics?
and
No one else uses the below mentioned silkscreen technique?
On Wednesday, June 02, 1999 10:52 AM, Mike Gish Wrote:
-----Original Message-----
From: Mike Gish [mailto:[log in to unmask]]
Sent: Wednesday, June 02, 1999 10:52 AM
To: [log in to unmask]
Subject: [DC] Silkscreen feature in between fine
pitch
I just finished reading an article that described adding
silksreen
features in between pads on fine pitch components to create
an
additional solder barrier between pads. Does anyone have
any experience
doing this? What is the minimum spacing that you found this
to be
effective? How hard was it to control the registration?
Was this
screen print applied in addition to mask webbing? What was
the width and
thickness of the screen print? Ditron Manufacturing
speciallizes in PCB
Assembly so you can imagine how helpful something this
simple could be.
any information you can provide would greatly be
appreciated.
What about using silkscreen barriers (Circles) around BGA
pads?
I haven't used this method in actual practice but appreciate
the theory
Talks in advance
Mike Gish
Sr. PCB Designer
Ditron Manufacturing, Inc.
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