To follow up on David's reply, there is a lot of information coming out and there is
a lot of information available right now. By early next week, IPC plans on posting
past technical papers and the Surface Mount Council White Paper on lead-free
electronics assemblies on our web site for free download. As soon as we have the
papers posted, I will put out an announcement on the leadfree listserv.
As far as what data will be released by the labs, OEMs, etc., I think that will be
based on the outcome of the conference. With the way the conference is structured
right now, we have set up all of the presentations on alloys, components and board
finishes first with the breakout sessions to follow. We will also be supplying
conference attendees with the Department of Trade and Industry (DTI) report, "An
Analysis of the Current Status of Lead-Free Soldering," which is a very comprehensive
report on lead elimination.
IPC is gathering as much information as possible on lead elimination for the PWB
industry. With all of the information we will be providing prior to and at the
conference, the attendees will then have enough knowledge on the issue to come away
from the conference with an IPC roadmap on lead elimination.
Best,
Chris
Chris Jorgensen
Technical Project Manager
IPCWorks '99 Conference Coordinator
An International Summit on Lead-Free Electronics Assemblies
October 25 - 28, 1999
Hyatt Regency, Minneapolis, MN
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>>> Paul Klasek <[log in to unmask]> 06/23/99 07:57PM >>>
Hi Werner , and all
Yes ; took me by surprise too ; IPC finally gearing into leadfree
politically correct inevitabilities .
Just in case you missed it ; this is the Leadfree Forum ; NOT TechNet .
Hopefully for me you're right with that ongoing conversation :
> First I'd appreciate anybody telling the good, bad and ugly(Matthias had a
good start on the Phinodal burn in) stories about the applied alloys (yes,
leadfree)
> Is out there any non proprietary literature anybody could recommend (on
the leadfree peculiarities)
> And ; as the reliability standards form base of most of our validations ;
how will you ; and IPC ; address the standard amendments for leadfree
alloys and corresponding fluxes ?
Is there ; or will be (the Minneapolis October Conference ?)some time line
for this subject ?
From what you say so far ; we're on our own as far as the evaluations go ;
or are there any labs (or OEM's willing to share data) being ahead on this
subject with some comparing results to give/sell/???
Matthias, Bob, Guenter, ? ; could you part with anything useful ?
Chris ; how do you envisage to get this issue from labs to open ;
is the conference the kickstart ?
Thanks A lot again
Paul Klasek
http://www.resmed.com
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Wednesday, June 23, 1999 10:45 PM
To: [log in to unmask]; [log in to unmask]
Subject: Re: Recommended ALLOYS ; independent papers
Hi Paul,
Your e-mail leads me to believe that I am walking in on an ongoing
conversation.
>What would the recommended or experienced alloys be ?
What are you talking about?
>What papers/publications would be advised ?
What are you talking about?
>Would this new alloys alter the existing reliability test guidelines (like
IPC-
>SM-785) to non applicability ;as most of the statistics were based on 63/37
?
Seems you are talking about solders, maybe lead-free. The reliability test
guidelines are o.k., but some of the specifics may have to be somewhat
altered, because they are based on modeling the behavior of near-eutectic
Sn/Pb solders. Having said that, I need to point out that adequate
reliability data for lead-bearing solders other than near-eutectic Sn/Pb do
not exist either. Modifications to the model coefficients is only possible
with adequate data. However, the scarce data in existance for these solders
indicate factor of 2 differences from near-eutectic Sn/Pb fatigue; thus, the
errors introduced by different solders has been small so far. This may
change
with lead-free solder alloys.
Neither the physics-of-failure nor the statistics for solder joint failures
will change, however.
Given the current tight (to none) resources atthe OEMs and industry labs, I
am not very hopeful that the necessary work to develop models for the other
solders will be undertaken in the forseeable future.
>Would any other IPC ; MIL ; IEC standards require reconsiderations ?
Well, that depends, I am sure (not much help here).
Werner Engelmaier
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IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
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For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.ipc.org/html/leadfree.htm ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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