IPCWorks '99 Conference Schedule - Day 2
The following is the tentative schedule for the second day of the IPCWorks '99
conference, featuring an International Summit on Lead-Free Electronics Assemblies.
Please note that the schedule could still change. If we do make any changes to the
schedule, you will be informed.
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Tuesday, October 26, 1999
8:00 a.m. to 8:30 a.m.
KEYNOTE
Dr. Iwona Turlik, Motorola - Electronics and the Environment
8:30 a.m. to 9:00 a.m.
NIST REPORT
Carol Handwerker, NIST
9:00 a.m. to 10:30 a.m.
COMPONENTS SESSION
Component finishes are one of the three key ingredients to lead-free electronics
assemblies. In this session, several component suppliers will bring you up to date on
their activities with lead-free component finishes
Presentations, Components Session
Piezoelectric Properties of Bismuth Layer-Structure Ceramics, Masakazu Hirose, TDK
Corp.
An Assessment of Lead Free Palladium Finished Components: The Impact on Assembly
Yields with Conventional Tin-Lead Solder, Dr. Chris Hunt, National Physical
Laboratory, Centre for Materials Measurement Technology
Lead Free Flip Solder for Flip Chip and CSP Applications, Peter Elenius, Flipchip
Technologies
10:30 a.m. to 5:00 p.m.
ALLOYS SESSION
The recipes for lead-free alloy alternatives are very expansive. Which alloy will be
the replacement. What are the criteria for selecting the alloys? Is Sn/Ag/Cu the
answer? How about Sn/Cu or Sn/Ag/Bi? Attendees of this session will gain a better
understanding of the alternatives and how to select the alternative to suit their
needs.
Presentations, Alloys Session
Alloy Selection by Worldwide Region and the Pros and Cons of the Various
Alternatives, Chris Bastecki, Alpha Metals
An Evaluation of Prototype Laminate and HMC Circuit Boards Assembled with Sn-Ag-Bi
and Sn-Ag-Bi-X Solders, Paul Vianco, Sandia National Labs
A Comparison of the Available Lead-Free Alloys to Tin-Lead Alloys, Karl Seelig, AIM
Solder
Development of Eutectic and Near-Eutectic Sn/Ag/Cu Solder Alloys for Lead-Free
Electronic Assemblies, Iver Anderson, Ames Lab
Improvement of Sn/Zn Alloys Soldering by Preventing Oxidation of Ink, Masahiro
Tadauchi, Toshiba Chemical Corp.
High Reliable Lead-Free Solder Pastes from Tn/Zn Alloy Systems, Takashi Shoji, Showa
Denko K. K.
Eutectic Sn-Bi as an Alternative Pb-free Solder, Fay Hua, Hewlett-Packard Company
An Integrated Approach to Lead-Free Processing, Alan Rae, Cookson
Prospect of Lead Free Alternatives for Reflow Soldering, Dr. Ning-Cheng Lee, Indium
Corporation of America
The Future is Now: No Longer Creeping Towards Lead Elimination, Angela Grusd, Heraeus
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The next posting will cover day three, which will be host to the breakout sessions
for the development of the IPC roadmap on lead elimination.
Chris Jorgensen
Technical Project Manager
IPCWorks '99 Conference Coordinator
An International Summit on Lead-Free Electronics Assemblies
October 25 - 28, 1999
Hyatt Regency, Minneapolis, MN
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IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.ipc.org/html/leadfree.htm ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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