See IPC-2221, para 6.3 and table 6-1 for general. See also figure 10-1
and 10-2 and para. 10 for beef-up/neck-down.
Bernhard
----------
Von: Mike Gish[SMTP:[log in to unmask]]
Gesendet: Donnerstag, 24. Juni 1999 01:57
An: [log in to unmask]
Betreff: Re: [DC] PAD TO VIA SPACING
it's based on your minimum spacing requirements and current
carrying
requirements
but there isn't a spec that describes a basic distance. Keep in
mind other
requirements also like design for testability and design for
manufacturability
[log in to unmask] wrote:
> Hello all,
>
> Can anyone tell me if there is an IPC standard for spacing
between a surface
> mount pad and a feedthru?
>
> Thanks,
> Mike W