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Date: | Thu, 27 May 1999 13:49:11 -0400 |
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Can anyone provide some information on the questions listed below:
1. - Are there any specifications (IPC or other) which should be referenced
in the PCB fabrication
drawing for NiAu finishing?
2. - At what point during fabrication is NiAu normally applied - before or
after LPI soldermask (or both)?
If both, what are pros / cons of each? Is it important to outline
desired Fab processing in the
fabrication drawing?
3. - What sources of NiAu info are available on the web?
Thanks,
Dave Schaefer
PWB Design Technical Lead
NORTEL Broadband Wireless Access
14 Fultz Boulevard
Winnipeg, MB R3Y 1V3
Phone: (204)631-2298 ESN 771
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