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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 2 Jun 1999 08:08:19 +0000 |
Content-Type: | text/plain |
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Hello,
Could anyone please tell me the temperature's, pressure's, and the dwell
time involved with thermocompression bonding for bonding flip-chip's to
substrates.
Thanks very much
Gareth Jones
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