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June 1999

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Thu, 3 Jun 1999 11:01:29 +0000
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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University of Salford
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Hello,

Could anyone please tell me the temperature's, pressure's, and the dwell
time involved with thermocompression bonding for bonding flip-chip's to
substrates. Also any potential manufacturers of this type of
equipment

Thanks very much

Gareth Jones

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