> Hello TechNetters,
>
> I am curious where I need to look for standards for measuring solder
> paste, post printing process. I have scanned the IPC catalogs I have and
> have not seen any indication for this. There is information on qualifying
> paste, and post reflow testing, but none that I can see for post printing.
>
> If (as I suspect) there is no established criteria/standard for
> acceptance/rejection of paste placement, and you do have some internally
> established criteria, I would appreciate your sharing of this information.
>
> Thank you all in advance.
>
> Richard Hamilton
> Clemar Mfg. / Rain Bird
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>