All,
I'm looking for the IPC resistive spec. for the flux left behind after the
wave solder/ IR process on the finished assembly board.
I've a couples of questions for anyone to address:
1. How to measure the resistive flux residue on the finished assembly
board level?
( is it a common in the industry that requesting Sub-con house to
measure and control them)?
2. What is the IPC recommended resistive spec. for the flux residue
that left behind( referring to Non-clean process)
Thanks,
Desmond Leu
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