Hi Aric -
Some thoughts on your questions:
The adhesive is intended to prevent the additive wiring getting into trouble,
ie.: flapping around during vibration; moving into a position where it can
short or chafe; stressing the soldered connection; moving around and work
hardening the wire adjacent to the soldered connection, etc.
The adhesive should be used sparingly, generally at intervals not exceeding
1", unless you have some extreme dynamics to endure. (Obviously, if you're
doing a mod with AWG 46 magnet wire, the bonded spots need to be considerably
closer, so let common sense and good engineering judgement prevail.)
Adhesive can be used to reinforce the soldered connection if necessary. (It
will also serve as a conformal coating if need be, when used in this manner.)
The only problem with a modest amount of adhesive on a soldered connection is
that it makes rework or modification slightly more difficult, should the need
arise.
Similarly, adhesives can be used sparingly in contact with component bodies.
A word of caution: EMBEDDING a glass or ceramic bodied part in some of the
harder epoxies, urethanes, etc., can result in part breakage or solder joint
damage during thermal cycling.
Most of the flouropolymer (Teflon, Tefzel, etc.) and silicone insulated wires
are not bondable without special treatment or special adhesives. Accordingly,
you may want to be selective about the insulation materials involved in your
modification wires.
I'm not aware of an industry or government standard that establishes precise
criteria on this subject. Since the situations vary so greatly dependent on
the modification and materials involved, this is probably for the better.
Regards - Kelly
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