Jason,
        The current working draft of IPC-7095, Design and Assembly
Process Implementation for BGAs, speaks to this issue in Section 6.4
(Impact of Wave Solder on Top Side BGAs) along with ways to validate and
correct if required. This is an extremely solid reference on BGAs, its
ultimate release will be of great help to those just beginning to
venture into BGAs. As the file is a little big for TechNet (don't want
to tick off Hugo, hehehe), I'll send it to you direct under separate
EMail. Remember that draft standards are usually available from IPC for
review and comment on a variety of topics, but any pass/fail criteria
should not be used as an absolute based on a draft revision.

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Jason Smith [SMTP:[log in to unmask]]
> Sent: Friday, June 11, 1999 2:45 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA reliability testing
>
> What does the industy do for qualifications and reliability for BGAs?
> What
> testing is generally done.  I'm trying to see if a BGA connection is
> affected in
> any way by going through the wave solder for qualifying that in our
> process.
> Any insight would be helpful.
>
> Jason
>
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