I used to be involved in printing ceramic hybrids and we used to 'print' the
conductive inks through the holes. The ink was printed over the holes and
then a vacuum was used to pull the ink through the holes. This was done on
both sides of the ceramic tile to ensure that there was a good connection
between both sides. This operation was always the first print to be carried
out.
===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
7/06/99 03:51
>Hi
>
>Can anyone provide me some infomation regarding through hole metalization
>for ceramic materials? Is that similar to the electroless Cu or direct
>metalization process for PWB material such as FR4?
>
>Thanks
>Li Kang
>
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