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June 1999

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TechNet <[log in to unmask]>
Subject:
Re: Solder Paste in through hole
From:
Jim Zanolli <[log in to unmask]>
Date:
Fri, 4 Jun 1999 07:34:00 -0400
In-Reply-To:
<[log in to unmask] o.com>
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"\"TechNet E-Mail Forum.\" <[log in to unmask]>, Jim Zanolli" <[log in to unmask]>
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text/plain (35 lines) 
Dear Paul;

Teka Interconnection Systems  <http://www.tekais.com> offers an alternative
to Intrusive reflow for connnectors. We can supply the connector with solid
solder and flux attached to each contact lead -- offering a significant
increase in solder volume as compared to screened solder paste.

Please contact me offline for additional information

Regards
Jim Zanolli

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