Sender: |
|
Subject: |
|
From: |
|
Date: |
Thu, 3 Jun 1999 07:39:46 -0700 |
Content-Type: |
text/plain; charset="iso-8859-1" |
MIME-Version: |
1.0 |
Reply-To: |
|
Parts/Attachments: |
|
|
Paul,
See the following document at Merix's website:
http://www.merix.com/resourcecntr/papers/osp.doc
Should give you a good comparison to the benefits and down side to OSP.
Regards,
Mike Beckman
ATD DPD Substrate Design Integration
[log in to unmask]
Ofc. 602 554-4232
-----Original Message-----
From: Paul Tomlinson [mailto:[log in to unmask]]
Sent: Thursday, June 03, 1999 4:58 AM
To: [log in to unmask]
Subject: [TN] Organic Soldereability Preservative.
Hi Technetters,
Has anybody any information on OSP (Organic Soldereability Preservative) re
its effectiveness as against solder coating, for enhanced solderability.
I have never heard the term OSP.
Paul
END --------------------- [log in to unmask] END
While there never is a perfectly right answer,
there are always several perfectly wrong ones!
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|