TECHNET Archives

June 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
Subject:
From:
"Beckman, Michael W" <[log in to unmask]>
Date:
Thu, 3 Jun 1999 07:39:46 -0700
Content-Type:
text/plain; charset="iso-8859-1"
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum.\" <[log in to unmask]>, \"Beckman, Michael W" <[log in to unmask]>
Parts/Attachments:
text/plain (72 lines)
Paul,
See the following document at Merix's website:
http://www.merix.com/resourcecntr/papers/osp.doc
Should give you a good comparison to the benefits and down side to OSP.
Regards,
Mike Beckman
ATD DPD Substrate Design Integration
[log in to unmask]
Ofc. 602 554-4232




-----Original Message-----
From: Paul Tomlinson [mailto:[log in to unmask]]
Sent: Thursday, June 03, 1999 4:58 AM
To: [log in to unmask]
Subject: [TN] Organic Soldereability Preservative.


Hi Technetters,

Has anybody any information on OSP (Organic Soldereability Preservative) re
its effectiveness as against solder coating, for enhanced solderability.

I have never heard the term OSP.

Paul

END --------------------- [log in to unmask] END


           While there never is a perfectly right answer,
           there are always several perfectly wrong ones!

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2