Mime-Version: |
1.0 |
Sender: |
|
Subject: |
|
From: |
|
Date: |
Thu, 3 Jun 1999 07:57:34 -0400 |
Content-Type: |
text/plain; charset="us-ascii" |
Comments: |
RFC822 error: <W> MESSAGE-ID field duplicated. Last occurrence
was retained. |
Reply-To: |
|
Parts/Attachments: |
|
|
Hi Technetters,
Has anybody any information on OSP (Organic Soldereability Preservative) re
its effectiveness as against solder coating, for enhanced solderability.
I have never heard the term OSP.
Paul
END --------------------- [log in to unmask] END
While there never is a perfectly right answer,
there are always several perfectly wrong ones!
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|