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June 1999

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From:
Paul Tomlinson <[log in to unmask]>
Date:
Thu, 3 Jun 1999 07:57:34 -0400
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RFC822 error: <W> MESSAGE-ID field duplicated. Last occurrence was retained.
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"\"TechNet E-Mail Forum.\" <[log in to unmask]>, Paul Tomlinson" <[log in to unmask]>
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Hi Technetters,

Has anybody any information on OSP (Organic Soldereability Preservative) re
its effectiveness as against solder coating, for enhanced solderability.

I have never heard the term OSP.

Paul

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